VIGON® PE 180, based on MPC® Technology (Micro Phase Cleaning), is a water-based, neutral pH cleaning agent specifically developed for spray-in-air equipment. VIGON® PE 180 effectively removes most flux residues from lead frames, discrete devices, power modules, and LEDs. It also easily eliminates oxide layers from copper surfaces, preparing them for subsequent processes such as wire bonding or die attach. 

Advantages Over Other Cleaning Agents

• Leaves no contamination on copper surfaces, ensuring optimal conditions for subsequent processes such as wire bonding and die attach.
• Excellent material compatibility with various surfaces.
• Easily rinsed off with water.
• Prevents copper surface oxidation for an extended period after cleaning.
• No need for wastewater neutralization, halogen-free.