Alkaline-Based Flux Cleaner for Semiconductor Electronics

HYDRON® SE 230A is a water-based cleaning solution that does not separate when mixed with water, specifically developed for ultrasonic cleaning processes.
SE230A completely removes flux residues from a wide range of semiconductor electronic components, such as leadframes, discrete devices, power modules, high-power LEDs, flip chips, and CMOS. This chemical provides oxidation protection for copper surfaces, ensuring optimal conditions for subsequent processes such as wire bonding or die attach.

Applications:

• PCB Flux Cleaning
• Flip Chip
• CMOS
• Power Modules

Suitable Cleaning Equipment:

• Ultrasonic Cleaning: Frequency of 40kHz or higher

Advantages Over Other Cleaning Agents:

• Reduces surface tension, ensuring effective cleaning, especially in hard-to-reach areas such as under component leads and bodies.
• High material compatibility, making it safe for use with sensitive materials such as copper, aluminum, and nickel.
• Prevents copper oxidation, keeping surfaces protected for extended periods.
• Easily rinsed with DI-water, leaving no residue and minimal odor.

Results