VIGON® SC 210 is a water-based cleaning agent specifically developed for cleaning SMT metal masks and stencils. This chemical effectively removes solder paste and SMT adhesive in a single process, eliminating the need for rinsing with water. It delivers optimal cleaning results even at low washing temperatures of 18°C/64°F. VIGON® SC 210 is designed for use in ultrasonic and high-pressure spray systems.
Advantages Over Other Cleaning Agents:
- Achieves effective cleaning results at temperatures between 18-40°C (64-104°F).
- Water-based, free of surfactants, leaving no residues on surfaces or inside equipment.
- Excellent material compatibility.
- No flash point, allowing safe use without explosion protection.
- Significantly low VOC value below 20%, ensuring compliance with VOC emission regulations.
- Non-foaming, mild odor, and no organic buildup in the cleaning process.
Results: